MANUFACTURING METHOD OF HIGH-SPEED SIGNAL STUBLESS THROUGH-HOLE MULTILAYER PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a high-speed signal stubless through-hole multilayer printed wiring board wherein a stub is removed without leaving behind a through-hole plated layer formed on a through-hole internal wall surface. SOLUTION: The method comprises a process (A) of drilling a through-hole 13 at a predetermined position of a multilayer printed wiring board 1 composed of a plurality of printed wiring boards 11 each including a wiring 12 laminated on the surface thereof using a drill 30, and of exposing an end 121 of a wiring 12A into the through-hole 13; a process (B) of forming the through-hole plated layer 14 on the inner wall of the through-hole 13; and a process (C) of scraping away unnecessary portions of the through-hole plated layer (stub) 14 in the through-hole 13 using a cutting tool 50 having substantially the same diameter as an inner diameter of the through-hole 13 and configured such that a guide part is provided at the tip end thereof. COPYRIGHT: (C)2005,JPO&NCIPI