发明名称 PACKAGING MATERIAL EXCELLENT IN MOLDABILITY AND PACKAGING CONTAINER MOLDED BY USING THE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a packaging material which is excellent in moldability in overhang molding, deep drawing molding, etc., can mold a sharp, deep molding height shape, and can suppress the occurrence of a pinhole, a crack, etc., a packaging container molded by using the material, and especially a lithium cell case high in volume energy density. SOLUTION: The packaging material has at least an outer layer of a heat resistant resin film, a metal foil layer, and an inner layer of a thermoplastic resin film. The heat resistant resin film of the outer layer has impact strength of at least 30,000 J/m. In the heat resistant resin film of the outer layer in the packaging material, tensile strength in four directions is preferably at least 150 N/mm<SP>2</SP>, and tensile elongation is preferably at least 80%. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005022336(A) 申请公布日期 2005.01.27
申请号 JP20030192172 申请日期 2003.07.04
申请人 SHOWA DENKO PACKAGING CO LTD 发明人 TANAKA KATSUMI;HATA HIROSHI
分类号 B65D65/40;B32B15/08;H01M2/02;(IPC1-7):B32B15/08 主分类号 B65D65/40
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