| 摘要 |
PROBLEM TO BE SOLVED: To provide a high reliability for solder-joining, in a secondary soldering ball package process by using a hardening flux. SOLUTION: In the hardening flux used for solder-joining and reinforcing the solder-joined part, an amphoteric surfactant is contained, and desirably, this hardening flux contains epoxy resin having two or more epoxy groups and a hardening agent having at least two phenolic hydroxyl group in one molecule and at least one or more carboxyl group in one molecule. Then, as the amphoteric surfactants, alkyl dimethyl amino betaine acetate, alkyl dimethyl amine oxide, alkyl carboxy methyl hydroxyethyl imidazolinium betaine, alkyl amido propyl betaine, alkyl hydroxy sulfo betaine, alkyl amino acid, etc., are desirable. COPYRIGHT: (C)2005,JPO&NCIPI
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