发明名称 WIRING CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To abolish generation of a voltage drop which cannot be ignored by a protrusion for connecting between upper and lower conductors for passing a large current by passing even a small current or large current through the protrusion 53 for connecting between the upper and lower conductors, generation of heating, or possibility of disturbance of improving an integration degree, by exclusively incorporating the wasteful large area of the protrusion which conducts small current by passing even small current or large current through the protrusion for connecting between relatively large upper and lower conductors. SOLUTION: A wiring circuit board includes protrusions 53x, 53y for connecting between the upper and lower conductors having a plurality of different kinds of diameters. The protrusion through which the large current passes in response to a passing current each increases its diameter (53x), and the protrusion through which the small current passes can be reduced in the diameter (53y). Thus, the possibility of arising the problem that the voltage drop occurs due to the large current flowing through the protrusion having the small diameter, a Joule heat is generated, or a wasteful area is exclusively incorporated in the protrusion due to the large diameter because of the small current flow. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026714(A) 申请公布日期 2005.01.27
申请号 JP20040273239 申请日期 2004.09.21
申请人 NORTH:KK 发明人 IIJIMA ASAO;OSAWA MASAYUKI
分类号 H05K1/11;(IPC1-7):H05K1/11 主分类号 H05K1/11
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