发明名称 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing a substrate which can detect the state of the substrate with a simple constitution. SOLUTION: In the apparatus for processing the substrate, the substrate W is supported by flat surfaces of four substrate supporting parts PS disposed on the upper surface of a conveying arm bm4. Three ultrasonic distance measuring sensors TS1, TS2 and TS3 are fixed to a fixed base KD installed above the substrate W. The three ultrasonic distance measuring sensors TS1, TS2 and TS3 are disposed so that a distance to the upper surface of the substrate W near the outer periphery of the substrate W can be measured. In this case, the ultrasonic distance measuring sensors TS1, TS2 and TS3 are disposed so that measured values of the ultrasonic distance measuring sensors TS1, TS2 and TS3 become equal in the state that the substrate W is supported normally. The ultrasonic distance measuring sensors TS1, TS2 and TS3 respectively measure distances to the upper surface of the substrate W, and give the measured values to a controller CL. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026668(A) 申请公布日期 2005.01.27
申请号 JP20040102676 申请日期 2004.03.31
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 ASA SEKIBUN
分类号 H01L21/677;H01L21/02;H01L21/304;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
代理机构 代理人
主权项
地址