SUBSTRATE PROCESSING METHOD AND APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method capable of raising throughput by improving processing efficiency while keeping the processing capability of a substrate without increasing an installation space and without increasing a manufacturing cost and a running cost upon processing the substrate with a processing tool. SOLUTION: When the substrate W is subjected to a predetermined processing with the processing tool 2 while carrying the substrate W, there is performed the processing of the substrate W with the processing tool 2 while moving the processing tool 2 in the same direction as a carrying direction of the substrate W at a lower speed than a carrying speed of the substrate W. COPYRIGHT: (C)2005,JPO&NCIPI