| 摘要 |
A signal transmission structure is provided. The structure comprises a reference plane, a bonding pad, a conductive trace and a conductive ball. By changing the shapes of the reference plane and the conductive trace, the equivalent capacitance at the conductive ball and the signal route near thereto is reduced, or the equivalent inductance at the conductive ball and the signal route near thereto is increased to compensate the high equivalent capacitance between the conductive ball and the reference plane. Therefore, the impedance of the conductive ball and the signal route near thereto are matched to increase the integrity of the signals after these signals pass through the conductive ball and the signal neighbor route thereto.
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