发明名称 Manufacturing method of a micro structure
摘要 A release layer is formed on a substrate, and plural thin-film patterns are formed on the release layer. The release layer is etched back at a prescribed depth at least in regions close to the circumferences of the thin-film patterns. The thin-film patterns are transferred sequentially to a counter substrate to be laminated on the counter substrate and to thereby form a micro structure. This manufacturing method is employed in a case that the combination of thin-film patterns and are lease layer is such that when a prescribed pressure is applied to each of the thin-film patterns on the release layer in the transferring, the height of a raised portion of the release layer that would be appeared in a region close to the circumference of the thin-film pattern if the release layer were not be etched back is greater than or equal to the thickness of the thin-film pattern.
申请公布号 US2005020005(A1) 申请公布日期 2005.01.27
申请号 US20040793906 申请日期 2004.03.08
申请人 FUJI XEROX CO., LTD. 发明人 HOTTA HIROYUKI;YAMADA TAKAYUKI;TAKAHASHI MUTSUYA
分类号 B81C99/00;B29C67/00;H01L21/00;H01L21/44;(IPC1-7):H01L21/44 主分类号 B81C99/00
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