发明名称 |
Manufacturing method of a micro structure |
摘要 |
A release layer is formed on a substrate, and plural thin-film patterns are formed on the release layer. The release layer is etched back at a prescribed depth at least in regions close to the circumferences of the thin-film patterns. The thin-film patterns are transferred sequentially to a counter substrate to be laminated on the counter substrate and to thereby form a micro structure. This manufacturing method is employed in a case that the combination of thin-film patterns and are lease layer is such that when a prescribed pressure is applied to each of the thin-film patterns on the release layer in the transferring, the height of a raised portion of the release layer that would be appeared in a region close to the circumference of the thin-film pattern if the release layer were not be etched back is greater than or equal to the thickness of the thin-film pattern.
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申请公布号 |
US2005020005(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040793906 |
申请日期 |
2004.03.08 |
申请人 |
FUJI XEROX CO., LTD. |
发明人 |
HOTTA HIROYUKI;YAMADA TAKAYUKI;TAKAHASHI MUTSUYA |
分类号 |
B81C99/00;B29C67/00;H01L21/00;H01L21/44;(IPC1-7):H01L21/44 |
主分类号 |
B81C99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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