发明名称 SEMICONDUCTOR DEVICE POWER INTERCONNECT STRIPING
摘要 A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.
申请公布号 WO2004061960(A3) 申请公布日期 2005.01.27
申请号 WO2003US39194 申请日期 2003.12.08
申请人 INTEL CORPORATION 发明人 OSBURN, EDWARD
分类号 H01L21/44;H01L23/498;H01L23/50;H01L27/10;H05K1/02;H05K1/11;H05K3/42 主分类号 H01L21/44
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