发明名称 HYDRODYNAMIC RADIAL FLUX TOOL FOR POLISHING AND GRINDING OPTICAL AND SEMICONDUCTOR SURFACES
摘要 <p>A polishing tool (A) useful for grinding and high precision, fine polishing of flat or curved optical surfaces, as well as for the optical flattening of semiconductor and metallic surfaces is presented. The tool (A) does not make contact with the surface to be polished. The invention is a tool (A) lacking moving parts, made of stainless steel and ceramic materials for some of its parts. Due to its hydrodynamic characteristics, it is possible to achieve polished surfaces of high-precision optical quality. The tool (A) produces a high velocity flux that expands radically and parallel to the working surface generating a stable, uniform and repeatable annular abrasion footprint. The design of the tool (A) allows to attain an optical surface starting from the grinding process up to the final polishing process without having to change the tool, avoiding friction against the work surface as well as tool wear. It can polish thin membranes and does not require a rigid or active support for the working surface. This invention considerably simplifies optical polishing processes and reduces costs with respect to other known methods.</p>
申请公布号 WO2005007343(A1) 申请公布日期 2005.01.27
申请号 WO2004MX00046 申请日期 2004.07.08
申请人 UNIVERSIDAD NACIONAL AUTONOMA DE MEXICO;RUIZ SCHNEIDER, ELFEGO, GUILLERMO;SOHN LOPEZ-FORMENT, ERIKA;SALAS CASALES, LUIS;LUNA AGUILAR, ESTEBAN, ANTOLIN 发明人 RUIZ SCHNEIDER, ELFEGO, GUILLERMO;SOHN LOPEZ-FORMENT, ERIKA;SALAS CASALES, LUIS;LUNA AGUILAR, ESTEBAN, ANTOLIN
分类号 B24C1/08;(IPC1-7):B24B37/04;B24B13/00 主分类号 B24C1/08
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