| 发明名称 |
[PROCESS FOR FABRICATING BUMPS] |
| 摘要 |
A bump fabrication process is provided. A substrate having a plurality of openings of various widths thereon is provided. The substrate is dipped into an electrolytic solution. A step current that increases gradually is provided to the solution to perform an electroplating operation so that the conductive material is deposited inside the openings to form bumps with uniform thickness.
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| 申请公布号 |
US2005016859(A1) |
申请公布日期 |
2005.01.27 |
| 申请号 |
US20040710020 |
申请日期 |
2004.06.14 |
| 申请人 |
HUANG MIN-LUNG;TSAI CHI-LONG;WENG CHAO-FU;SU CHING-HUEI |
发明人 |
HUANG MIN-LUNG;TSAI CHI-LONG;WENG CHAO-FU;SU CHING-HUEI |
| 分类号 |
C25D5/02;C25D5/18;H01L21/288;H01L21/60;H01L23/48;(IPC1-7):C25D5/02 |
主分类号 |
C25D5/02 |
| 代理机构 |
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代理人 |
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