| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealing device from which a remaining resin can be removed easily and surely by freely setting gaps among molds as necessary even when the molds are three-plate type molds. SOLUTION: A fixed mold 5, a first movable mold 6, and a second movable mold 7 are successively disposed in this order in connectable and separable states. An electronic component mounted on a substrate 40 is sealed with a resin M by pinching the substrate 40 by means of the first and second movable molds 6 and 7 and packing the resin M in a cavity. At the time of sealing the component with the resin M, the first and second movable molds 6 and 7 can be driven and controlled independently. COPYRIGHT: (C)2005,JPO&NCIPI
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