发明名称 |
Pitch change and chip scale stacking system |
摘要 |
The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and its application environment. The module has a ballout pattern with a different pitch and/or supplemental module contacts devised to allow combined signaling to the integrated circuits through contacts having a desired ballout footprint. The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.
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申请公布号 |
US2005018412(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040914483 |
申请日期 |
2004.08.09 |
申请人 |
STAKTEK GROUP, L.P. |
发明人 |
ROPER DAVID L.;CADY JAMES W.;WILDER JAMES;WEHRLY JAMES DOUGLAS;BUCHLE JEFF;DOWDEN JULIAN |
分类号 |
H01L23/31;H01L23/498;H01L23/538;H01L25/10;H05K1/14;H05K1/18;H05K3/36;(IPC1-7):H05K1/14 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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