EXPOSURE DEVICE, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD

摘要

Position shift amounts in the X direction and Y direction are detected between a transfer image of the mark formed by scan exposure under a low-speed scan condition and a transfer image of the mark formed by the scan exposure under a high-speed scan condition (steps 602 to 630). The reticle manufacturing error is removed from the position shift amount detected (step 632). Furthermore, a correction function is generated for correcting the measurement value of the interferometer measuring the wafer stage or the reticle stage according to the position shift amount from which the reticle manufacturing error is removed (step 634). When performing scan exposure in the actual process, the measurement value is corrected by the correction function generated and the stage control is performed according to the measurement value corrected.