发明名称 CHIP TYPE SOLID ELECTROLYTIC CAPACITOR, ITS MANUFACTURING METHOD, AND LEAD FRAME USED THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor that is excellent in productivity and reliability having a plated fillet, its manufacturing method, and a lead frame used therefor. SOLUTION: A chip type solid electrolytic capacitor is coated with a coating resin 17, and is provided with an anode terminal 13 and a cathode terminal 14 having exposed surfaces on a substrate-packaged face and exterior side that is roughly perpendicular to the substrate-packaged face. The exposed face of the anode terminal 13 on the exterior side comprises cut surfaces 16 and a plated fillet 15. Moreover, a belt-like lid material 18a is arranged adjoining the top side of the plated fillet 15, and the coating resin 17 is isolated from the plated surface of the fillet 15. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026635(A) 申请公布日期 2005.01.27
申请号 JP20030270914 申请日期 2003.07.04
申请人 NEC TOKIN CORP;NEC TOKIN TOYAMA LTD 发明人 ISHIJIMA MASAYA
分类号 H01G9/15;H01G9/00;H01G9/012;H01G9/04;(IPC1-7):H01G9/15 主分类号 H01G9/15
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