| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is excellent in mountability and reliability, a method of manufacturing the same, a circuit board, and electronic equipment. <P>SOLUTION: A first semiconductor chip 10, on which a plurality of first pads 14 are formed, is mounted on a wiring board 20. The first pads 14 are electrically connected to respective wiring patterns 22 with wires 30. A resin paste is applied on the first semiconductor chip 10. A second semiconductor chip 50, on which a plurality of second pads 54 are formed, is mounted on the first semiconductor chip 10 via the resin paste. The resin paste is cured to form a spacer 60, and the first and second semiconductor chips 10, 50 are fixed. The spacer 60 is so formed that it extends to the outside of the bottom parts of the second pads 54. The wires 30 are so formed that its highest part is arranged to be the outside of the first semiconductor chip 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
