| 摘要 |
PROBLEM TO BE SOLVED: To provide the electronic apparatus of a flexible multilayer wiring board structure in which a semiconductor chip is embedded within the multilayer wiring board. SOLUTION: At the surface in the side to form a wiring film 11 of a first metal base plate including a bump 13 for terminal at the rear surface, a flexible semiconductor chip 20 in the thickness of 10 to 50μm or less is connected by the flip-chip connection method so that the electrode thereof is connected to the wiring film 11. In a second metal base plate 56, a bump 52 for interlayer connection and a chip accommodating space 42 are provided in the same surface, and a wiring film is formed to the opposite side. The base plate 56 is laminated to a first metal base plate 16 to connect the top surface of the bump 52 for interlayer connection to the wiring film 11, and an interlayer insulating film 40 is provided between the bumps 52. COPYRIGHT: (C)2005,JPO&NCIPI |
