| 摘要 |
PROBLEM TO BE SOLVED: To further prevent the corrosion of laying wires covered with protective layers disposed on the circumference of a semiconductor chip for driving a liquid crystal. SOLUTION: The semiconductor chip 14 is attached via an anisotropic conductive adhesive 17 to a juncture inclusive of an output terminal 9 and input terminal 10 on a projection part 1a of a segment substrate 1. In such a case, the output terminal 9 is connected via the laying wire 11 to as segment electrode 3 and the input terminal 10 is connected via the laying wire 12 to an external connection terminal 13. The laying wires 11 and 12 are covered with protective layers 25 composed of an epoxy resin, phenolic resin, silicone, polyimide, etc., The protective layers 25 are covered with protective films 26 composed of polyimide films, PET films, etc. The corrosion of the laying wires 11 and 12 covered by the protective layers 25 can be further prevented by the presence of the protective films 26. COPYRIGHT: (C)2005,JPO&NCIPI
|
