RESIN-SEALED PHOTOELECTRIC CONVERSION INTEGRATED DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin-sealed photoelectric conversion integrated device that can inexpensively reduce the influence of heat as compared with the conventional photoelectric conversion integrated device. SOLUTION: This resin-sealed photoelectric conversion integrated device is provided with a photoelectric conversion element 21 having a light receiving section 22, a lead frame 24 on which the element 21 is mounted and which is electrically connected to the element 21, and a sealing resin mold 20 which partially seals the element 21 and the frame 24. The mold 20 has openings 26 and 27. The opening 26 is formed to expose at least the light receiving section 22 of the element 21 to the outside, and the other opening 27 is formed to expose at least the portion of the lead frame 24 on the side opposite to the side mounted with the element 21. COPYRIGHT: (C)2005,JPO&NCIPI