SEMICONDUCTOR DEVICE AND INTERPOSER

摘要

A semiconductor device wherein connection pads for wire bonding are arranged in a peripheral edge region of an electrode-terminal-forming surface of a semiconductor element, test pads for semiconductor element testing are arranged in an inner region of the electrode-terminal-forming surface surrounded by the peripheral edge region, and wherein a plurality of re-wiring patterns, which extend from the peripheral edge region to the inner region on the electrode-terminal-forming surface, connect electrode terminals to the respective corresponding connection pads and test pads.