| 摘要 |
<p>A homogeneous mixture of conducting/semiconducting, insulating and binder particles, is vibration densified in a tubular mould tool mounted vertically on a combined vibrator/centrifuge and then externally heated to curing temp. whilst being spun so that the heavy conducting and filler particles form an outer layer, the molten binder being forced to flow to form an inner skin. The element is cooled through the walls of the mould tool core so as to cool it at the same rate as the mould tool, to room temp. 100 p.b.w. of finely powdered epoxy resin with hardener, 100-150 p.b.w. SiC and 40-45 p.b.w. of SiO2 or Al2O3 filler are mixed. Curing is at 240 degrees C. and the mould is spun at approx. 3000 r.p.m. The mould tool walls are chromium plated or plastic coated.</p> |
