| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To simultaneously complete an electric connection between a printed electric circuit board and a soft electric circuit board of an image detecting chip packaging in a single manufacturing process, thereby simplifying the electric connection manufacturing process after chip packaging, and sumultaneously reducing the manual operation to improve the production yield. <P>SOLUTION: A chip packaging substrate having this soft electric circuit board is provided with the soft electric circuit board packaging an image detecting chip 20 in a chip packaging board 10. And, the soft electric circuit substrate is used as an external signal connection wire. Therefore, there are included a multilayer soft and hard compound printed electric circuit board , a plurality of guide holes and a plurality of conductive members. The multilayer soft and hard compound printed electric circuit board is provided with a hard printed electric circuit board and at least one piece of soft electric circuit board. And, an inner edge portion of the guide hole in the soft electric circuit board is plated, and thereby there are included a plurality of conductive members for electrically connecting the multilayer hard printed electric circuit board with at least one piece of the soft electric circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
