| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device improved in reliability to such a degree that no crack occurs in the connection of a mounted electronic component by reducing the thermal stress generated from the material of an encapsulating case. SOLUTION: In this electronic device, a plurality of lead members 9 is integrally formed in the encapsulating case 5 by molding. An electronic circuit unit containing a detector 1 is disposed in the opening of the case 5 and electrically connected to the lead members 9. Electronic components 7 and 8 are connected between the lead members 9. Here, the lead members 9 are fixed to the encapsulating case 5 in restricted states in the vicinities of both ends of the members 9, and the electronic components 7 and 8 are fixed to the nonrestricted portions of the lead members 9 between the restricted portions of the members 9. COPYRIGHT: (C)2005,JPO&NCIPI |
