| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiating member that can efficiently radiate the heat generated from an electric component. SOLUTION: This heat radiating member 10 for electronic components, that radiates the heat generated from an IC chip 20 has a contact 11 which is in contact with the chip 20, and a heat radiator 12 which radiates the heat transferred from the chip 20 through the contact 11. The contact 11 is formed in a state where the contact 11 is protruded from the heat radiator 12 and the coefficient of thermal conductivity of the contact 11 is higher than that of the heat radiator 12. COPYRIGHT: (C)2005,JPO&NCIPI
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