发明名称 LUMINESCENT MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a luminescent module which can raise a light retrieving efficiency from a mold coating a light emitting element chip, and which can hence obtain a higher luminance. <P>SOLUTION: The luminescent module 1 includes the light emitting element chip 20 having a luminescent layer 24 made of a laminate of compound semiconductor layers, and the mold 60 having light transmission properties to an emitting light luminous flux from the luminescent layer 24. The mold 60 has a first mold layer 10 in which a refractive index of the light emitting element chip 20 in an ambient space is 1.45 or more, and is smaller than the refractive index of a compound semiconductor for forming the uppermost layer of the light emitting element chip 20, and a second mold layer 11 made of a fluororesin in which a refractive index is 1.0 to less than 1.45 at the outside of the first mold layer 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026302(A) 申请公布日期 2005.01.27
申请号 JP20030187497 申请日期 2003.06.30
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 YAMADA MASAHITO
分类号 H01L33/30;H01L33/54;H01L33/56;H01L33/62 主分类号 H01L33/30
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