发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATING PROCESS THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a high luminance semiconductor light emitting device having excellent optical characteristics by preventing variation in the fabrication process of the semiconductor light emitting device. <P>SOLUTION: In the semiconductor light emitting device where a lead frame 2 mounting a light emitting element 3 is resin sealed, the light emitting element 3 is die bonded to the first electrode 6 of a pair of electrodes on the lead frame 2 and wire bonded to the second electrode 7. The light emitting element 3 is then die clamped and sealed with light transmitting resin to form a resin sealed part 4. A reflective frame 5 is then fitted to the side face of the resin sealed light emitting device thus producing a semiconductor light emitting device. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026400(A) 申请公布日期 2005.01.27
申请号 JP20030189360 申请日期 2003.07.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUEYOSHI KAZUHIRO
分类号 H01L33/54;H01L33/56;H01L33/62 主分类号 H01L33/54
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