发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATING PROCESS THEREFOR |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high luminance semiconductor light emitting device having excellent optical characteristics by preventing variation in the fabrication process of the semiconductor light emitting device. <P>SOLUTION: In the semiconductor light emitting device where a lead frame 2 mounting a light emitting element 3 is resin sealed, the light emitting element 3 is die bonded to the first electrode 6 of a pair of electrodes on the lead frame 2 and wire bonded to the second electrode 7. The light emitting element 3 is then die clamped and sealed with light transmitting resin to form a resin sealed part 4. A reflective frame 5 is then fitted to the side face of the resin sealed light emitting device thus producing a semiconductor light emitting device. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005026400(A) |
申请公布日期 |
2005.01.27 |
申请号 |
JP20030189360 |
申请日期 |
2003.07.01 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUEYOSHI KAZUHIRO |
分类号 |
H01L33/54;H01L33/56;H01L33/62 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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