| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a module with built-in component which is high in a density and connection reliability. <P>SOLUTION: The module with built-in component 100 is provided with an electric insulation layer 1, a first wiring pattern 2 formed so as to be exposed on one surface of the electric insulation layer 1, a circuit component 3 provided on the first wiring pattern 2 so as to be buried into the electric insulation layer 1, a first via 4 formed to communicate one surface side of the electric insulation layer 1 with the other surface side of the same, and a first via land 2a formed so as to be exposed on one surface of the electric insulation layer 1 so that the land 2a is connected electrically to the first via 4. Further, the first via land 2a is formed so as to be projected from the wiring pattern 2 from one surface of the electric insulation layer 1 toward the inside of the electric insulation layer 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
