| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method which does not require a separate heat source for pre-heating and by which the miniaturization of equipment and the reduction of equipment costs can be realized, and a soldering device. SOLUTION: The soldering method is constituted as follows. A heat sink 5 is heated by immersing a part 5a (a solder immersion part) of the heat sink 5 in molten solder 4 in a soldering tank 2. A soldering target W is pre-heated by a part 5b (a heat radiation part for pre-heating), which is not immersed in the molten solder 4 in the soldering tank 2 of the heated heat sink 5. After that, the preheated soldering target W is soldered. COPYRIGHT: (C)2005,JPO&NCIPI |
