发明名称 RESIN COMPOSITION FOR BOARD
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which inhibits formaldehyde as much as possible, improves wet strength, and has excellent water resistance, and to provide a molded article obtained from the composition. SOLUTION: This resin composition comprises (A) a carboxy group-containing resin obtained by polymerizing a carboxy group-containing polymerizable unsaturated monomer and (B) at least one hydroxy group-containing organic compound selected from polyvinyl alcohol, starch, pulp and rubbers. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005023129(A) 申请公布日期 2005.01.27
申请号 JP20030187353 申请日期 2003.06.30
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 MISE TSUYOSHI;INADA TADAHIRO;SHIMAZAKI SHIN;NISHIIKE HARUKI
分类号 B27N3/00;C08L1/02;C08L3/00;C08L21/00;C08L29/04;C08L57/10;(IPC1-7):C08L57/10 主分类号 B27N3/00
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