发明名称 HANDLING DEVICE FOR CHIP ELECTRONIC COMPONENT AND HANDLING METHOD FOR CHIP ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a chip electronic component handling device and a chip electronic component handling method having fewer restrictions of operation at the time of delivery of chip electronic components and enabling high-speed and effective processing of the chip electronic components. SOLUTION: A product inspecting device is provided with a disciform drum 10 for conveyance, a disciform disc 55 for conveyance, a parts feeder 60 comprised of a ball feeder 61 and a linear feeder 62, a delivery mechanism part 63 and takeout mechanism parts 64, 65. Outermost peripheries of the disciform drum 10 for conveyance and the disciform disc 55 for conveyance have a structure preventing them from invading into the other's rotating region (from interfering with each other). Regrading the disc 55 for conveyance, a position for gripping or sucking and holding the chip electric components 70 is not predetermined, and the chip electronic components 70 may be properly placed on arbitrary positions of an outer peripheral edge part. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005022769(A) 申请公布日期 2005.01.27
申请号 JP20030187270 申请日期 2003.06.30
申请人 MURATA MFG CO LTD 发明人 IWASA MASANOBU
分类号 B65G47/14;(IPC1-7):B65G47/14 主分类号 B65G47/14
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