发明名称 PROCESS FOR REMOVING AN ORGANIC LAYER DURING FABRICATION OF AN ORGANIC ELECTRONIC DEVICE AND THE ORGANIC ELECTRONIC DEVICE FORMED BY THE PROCESS
摘要 A method of dry etching a performance sensitive element of an organic electronic device, said method comprising the steps of: (a) having at least one performance sensitive element on the substrate spaced apart from a first conductive member, wherein at least one of the performance sensitive elements is a conductive lead; (b) placing organic material on the performance sensitive element and the first conductive member; (c) forming a patterned conductive layer over the organic material exposing a predetermined portion of the performance sensitive elements; and (d) dry etching the organic material in the exposed areas of the performance sensitive elements using at least one oxygen-containing gas, and organic electronic device created using said process.
申请公布号 US2005019977(A1) 申请公布日期 2005.01.27
申请号 US20030625112 申请日期 2003.07.22
申请人 PRAKASH SHIVA 发明人 PRAKASH SHIVA
分类号 H01L27/32;H01L51/00;H01L51/30;H01L51/40;H01L51/56;(IPC1-7):H01L51/40 主分类号 H01L27/32
代理机构 代理人
主权项
地址