发明名称 Manufacturing semiconductor, other finely-structured components involves setting working distance at least temporarily to less than maximum size of optical near field of emanating projection light
摘要 <p>The method involves providing a mask with a defined pattern in an object plane of a projection objective (5) and a light-sensitive substrate (10) near the image plane (12), illuminating the pattern with ultraviolet light of defined working wavelength, projecting an image of the pattern onto the substrate, setting a finite working distance (16) between an illumination light output surface (15) and an input coupling surface (11) and setting the working distance at least temporarily to less than the maximum size of an optical near field of the emanating light . An independent claim is also included for the following: (a) a projection illumination system.</p>
申请公布号 DE10332112(A1) 申请公布日期 2005.01.27
申请号 DE2003132112 申请日期 2003.07.09
申请人 CARL ZEISS SMT AG 发明人 SCHUSTER, KARL-HEINZ
分类号 G02B7/28;G02B13/14;G03F7/20;H01L21/027;(IPC1-7):G03F7/20 主分类号 G02B7/28
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