Semiconductor package for use in electronic product, has substrate including inner lands connected to pads of semiconductor chip via window of substrate by electrical connection medium

摘要

The package has a semiconductor chip mounted on a surface of a substrate (PCB1). A substrate (PCB2) includes inner lands that are connected to pads of a semiconductor chip (CP1) via a window of the latter substrate by an electrical connection medium. A third substrate (PCB3) has inner lands that are connected to pads of a semiconductor chip (CP2) via a window of the third substrate by the electrical connection medium.