发明名称 SEMICONDUCTOR DEVICE CAPABLE OF REDUCING SIZE AND PROTECTING EACH SEMICONDUCTOR SUBSTRATE FROM DISTURBANCE
摘要 PURPOSE: A semiconductor device is provided to reduce the size by enhancing the structure and to protect each semiconductor substrate from disturbance by forming a conductive layer on an upper substrate. CONSTITUTION: A plurality of semiconductor substrate(3,5,7,9) are interposed between an upper substrate(1) with a plurality of through holes(13,15,17,19) and a lower substrate(11). Each semiconductor substrate includes a voltage extracting portion. One of the semiconductor substrates includes the voltage extracting portion at its corner. The area of the corner is the same as those of the voltage extracting portions of the other semiconductor substrates. A conductive layer is formed on the upper substrate to shield the semiconductor substrates from disturbance.
申请公布号 KR20050010479(A) 申请公布日期 2005.01.27
申请号 KR20040036262 申请日期 2004.05.21
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OTANI, HIROSHI
分类号 H01L21/60;B81B3/00;B81B7/00;G01P1/02;G01P9/04;G01P15/08;G01P15/125;H01L21/00;H01L21/3205;H01L21/768;H01L23/52;H01L23/552;H01L23/60;H01L29/84;H01L31/113 主分类号 H01L21/60
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