摘要 |
PURPOSE: A semiconductor device is provided to reduce the size by enhancing the structure and to protect each semiconductor substrate from disturbance by forming a conductive layer on an upper substrate. CONSTITUTION: A plurality of semiconductor substrate(3,5,7,9) are interposed between an upper substrate(1) with a plurality of through holes(13,15,17,19) and a lower substrate(11). Each semiconductor substrate includes a voltage extracting portion. One of the semiconductor substrates includes the voltage extracting portion at its corner. The area of the corner is the same as those of the voltage extracting portions of the other semiconductor substrates. A conductive layer is formed on the upper substrate to shield the semiconductor substrates from disturbance. |