发明名称 |
Method and apparatus for processing semiconductor devices in a singulated form |
摘要 |
Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste. |
申请公布号 |
US2005017739(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040919667 |
申请日期 |
2004.08.16 |
申请人 |
HAMREN STEVEN L.;CRAM DANIEL P. |
发明人 |
HAMREN STEVEN L.;CRAM DANIEL P. |
分类号 |
G01R1/04;H05K3/32;(IPC1-7):G01R31/302;G01R31/02 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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