| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit substrate which can effectively use a space at a low cost and can use a connector of various state, and to provide an image forming apparatus using the same. <P>SOLUTION: The circuit substrate 50 includes drive circuits 51, 52 each for driving a motor, a CPU 101, connectors 59, 61 of front surface mounting type, and connectors 62-64 of dip type mounted at ends of the same side on the same surface. A load having a large current capacity is connected to the connector of the surface mounting type, and a load having a small current capacity is connected to the connector of the dip type. The connector of the front surface mounting type is mounted at the inside to a center, and the connector of the dip type is mounted at the outside. The connector of the front surface mounting type and wiring of an electronic part are disposed on a surface A, and the connector of the dip type and the wiring of the electronic part are disposed on a surface B. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
