| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which uses resin sealing and can be manufactured at a low cost by enabling laser trimming in a final product. SOLUTION: The semiconductor device has a semiconductor element 2 stored and mounted in a semiconductor recessed part 5 formed on one surface 1a of a substrate 1 and also has a passive element 3 and a trimmable element 4 mounted on the other substrate surface 1b on the opposite side from the surface 1a where the semiconductor element 2 is formed. This semiconductor device is structured by covering the passive element 3 and trimmable element 4 with a light transmissive resin layer 15 transmitting laser light Hv used to trim the trimmable element 4. In the final product form that the passive element 3 and trimmable element 4 are coated with the light-transmissive resin layer 15, the trimmable element 4 is irradiated with the laser light Hv to adjust characteristics. COPYRIGHT: (C)2005,JPO&NCIPI |
