发明名称 WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide the wiring method of conductor patterns formed on both sides of a wiring substrate main body by a very simple constitution. SOLUTION: The wiring substrate is provided with conductor patterns 11, 13, formed on both sides of the wiring substrate main body 2, in which penetrating wiring 6 is formed in the substrate, and the conductor patterns 11, 13 on both sides of the wiring substrate main body 2 are electrically connected to the penetrating wirings 6. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026476(A) 申请公布日期 2005.01.27
申请号 JP20030190623 申请日期 2003.07.02
申请人 FUJIKURA LTD 发明人 WADA HIDEYUKI;ITOI KAZUHISA;SUEMASU TATSUO
分类号 H05K1/11;H05K3/06;(IPC1-7):H05K1/11 主分类号 H05K1/11
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