发明名称 COVER TAPE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a cover tape for an electronic component for surely peeling off the same from a carrier tape and for preventing residual materials of the cover tape from being clogged in a mounting device to cause troubles. SOLUTION: This cover tape 10 is formed with many slits 11a and 11b at a predetermined pitch on both right and left ends in the direction crossing longitudinally at right angles. The slits 11a and 11b are formed by cutting the right and left edges of the tape 10 at a predetermined angle and in a predetermined length. Because the tape 10 has the slits 11a and 11b, even when a cut is formed at the edge, the cut stops when it reaches the slits 11a or 11b for preventing the cut off of the tape 10 and for surely peeling off the tape 10 from the carrier tape. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005022732(A) 申请公布日期 2005.01.27
申请号 JP20030270003 申请日期 2003.07.01
申请人 SHINDENGEN ELECTRIC MFG CO LTD;AKITA SHINDENGEN:KK 发明人 SUGAWARA TETSUHARU
分类号 B65D73/02;B65D85/86;(IPC1-7):B65D73/02 主分类号 B65D73/02
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