| 发明名称 |
Device for cooling memory modules |
| 摘要 |
A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact areas bearing in a planar manner.
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| 申请公布号 |
US2005018401(A1) |
申请公布日期 |
2005.01.27 |
| 申请号 |
US20040829362 |
申请日期 |
2004.04.22 |
| 申请人 |
STOCKEN CHRISTIAN;SCHRODER STEPHAN;HUBER THOMAS;PROLL MANFRED |
发明人 |
STOCKEN CHRISTIAN;SCHRODER STEPHAN;HUBER THOMAS;PROLL MANFRED |
| 分类号 |
G06F1/20;H01L23/367;H01L23/433;(IPC1-7):H05K7/20 |
主分类号 |
G06F1/20 |
| 代理机构 |
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代理人 |
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| 地址 |
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