| 发明名称 |
Plating method |
| 摘要 |
Compositions suitable for electroplating copper including one or more sources of copper, one or more alkanolamines or polymeric amines; and water are provided. These compositions are useful in the deposition and repair of seed layers used in the manufacture of electronic devices. Methods using these compositions are also provided.
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| 申请公布号 |
US2005020068(A1) |
申请公布日期 |
2005.01.27 |
| 申请号 |
US20040852706 |
申请日期 |
2004.05.24 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. |
发明人 |
WANG DEYAN;MIKKOLA ROBERT D. |
| 分类号 |
C25D3/38;C25D5/54;C25D7/12;H01L21/288;H01L21/44;H01L21/768;(IPC1-7):H01L21/44 |
主分类号 |
C25D3/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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