| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate which is free from defects that occurs in the vicinity of electrodes after baked as well as achieves sufficient flatness and high dimensional accuracy, and also to provide a method of manufacturing the same. SOLUTION: This multilayer ceramic substrate comprises: a glass ceramic 6; wiring patterns 2, 4 formed inside the glass ceramic 6 and on at least one major surface thereof; and via-conductors 3 for connecting the prescribed wiring patterns 2, 4 to each other. The via-conductors 3 contains a conductive material and a Mo compound or a Mo metal, wherein the conductive material includes at least one selected from the group consisting of Ag, Au, Pt and Pd as a main component, and also the amount of the Mo compound or the Mo metal is in the range of 0.05 to 10 parts by weight in terms of a Mo metal with respect to 100 parts by weight of the conductive material. COPYRIGHT: (C)2005,JPO&NCIPI |
