| 摘要 |
PROBLEM TO BE SOLVED: To stably provide a board for a printed circuit which is high in an initial adhesive strength to a conductive metallic layer formed on a heat-resistant film, which is high in an adhesive strength under the conditions of high temperature and humidity when it is left to stand for a long time after it is subjected to electroless tin plating and thermal loading, and which is excellent in dimension stability and durability. SOLUTION: This board for a printed circuit is constituted by successively laminating a heat-resistant resin layer B and a conductive metallic layer on at least one face of a heat-resistant insulating film A, wherein the heat-resistant insulating film A is constituted as a multi-layer film with two or more layers. COPYRIGHT: (C)2005,JPO&NCIPI |
