| 摘要 |
This aim is reached by a method for manufacturing an electronic module comprising at least one electronic component (4) and a layer formed by a binder, the electronic component (4) presents a visible face on the surface of the module, characterized in that one places a frame (3) on a protection sheet (2) placed on a base plate (1). At least one electronic component (4) is then placed on the protection sheet (2) and inside the frame (3). A pressing plate (6) is leant on the outline of the frame (3) before the introduction of a binder through orifices (5) pierced in the frame (3). This binder encapsulates the electronic component (4) by filling the space defined by the frame (3), the protection sheet (2) and the pressing plate (6). After solidification of the binder, the base plate (1) and the pressing plate (6) are removed.
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