| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that, when sealing a translucent cap to a base, if there is a foreign matter attaching to the sealed side of the cap, the foreign matter cannot be removed after sealing, and if the foreign matter is a conductive material, unwanted electrical contact is induced which becomes a cause for such defects as leakage and short circuits. <P>SOLUTION: In a method of manufacturing a semiconductor device, after the translucent cap 5 is mounted and positioned on a positioning block 22 of a cap cleaner 9 and then high-pressure air is fed through an air inlet 25, the high-pressure air is jetted out toward the translucent cap 5 from a plurality of jet-out ports 28 formed in a nozzle 24. Total fourteen jet-out ports 28 are formed at equal intervals so that the high-pressure air is spread over the entire surface of the translucent cap 5. The foreign matter such as dust attaching to the surface of the translucent cap 5 is removed by the high-pressure air which has been jetted out. Simultaneously with the jetting-out of the high-pressure air, the air is sucked through an air outlet 27. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
