发明名称 Holzfaserplatte und Herstellverfahren dafür
摘要 <p>The wood fiberboard of the present invention comprises wood fibers which have been subjected to an acetylation treatment and wood fibers which have not been subjected to an acetylation treatment bonded together by a binder resin, wherein the content of the wood fibers which have been subjected to an acetylation treatment is 35 to 90% by weight of the total amount of wood fibers which have been treated to an acetylation treatment and wood fibers which have not been subjected to an acetylation treatment.</p>
申请公布号 DE10012427(B4) 申请公布日期 2005.01.27
申请号 DE2000112427 申请日期 2000.03.15
申请人 YAMAHA CORP., HAMAMATSU 发明人 IWATA, RITSUO;HIRANO, YOSHIHIRO;SUZUKI, SATOSHI;FUKUDA, KATSUNOBU;WATANABE, HIRONORI
分类号 B27N1/02;B27N1/00;B27N3/00;B27N3/04;B27N3/08;(IPC1-7):B27N3/00 主分类号 B27N1/02
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