发明名称 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
摘要 After a fluid film is formed by supplying a material with fluidity to the surface of a substrate formed with a stepped layer, the fluid film is pressed against the substrate by a pressing member having a planar pressing surface so that the surface of the fluid film is planarized. The fluid film is heated in this state and thereby solidified to form a solidified film having a planar surface. <IMAGE>
申请公布号 EP1341224(A4) 申请公布日期 2005.01.26
申请号 EP20010974736 申请日期 2001.10.09
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NAKAGAWA, HIDEO;SASAGO, MASARU;ENDO, MASAYUKI;HIRAI, YOSHIHIKO
分类号 H01L21/027;H01L21/3105;H01L21/312;H01L21/316;H01L21/768 主分类号 H01L21/027
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