发明名称 |
System and method for curing a resin disposed between a top and bottom substrate with thermal management |
摘要 |
A system and method cure a combination of a top (6) and a bottom (6) substrate with a resin (8) disposed in-between. A cure platform (1500) includes a chuck on which the combination rests. A cure device (1700) cures the resin. An actuation assembly (1560) separates the chuck (1530) from the platform to thermally isolate the chuck during a curing operation performed by the cure device. A post cooling assembly may be provided to cool the chuck and the combination after a curing operation is performed by the cure device. <IMAGE> |
申请公布号 |
EP1164009(A3) |
申请公布日期 |
2005.01.26 |
申请号 |
EP20010122001 |
申请日期 |
1998.11.12 |
申请人 |
FIRST LIGHT TECHNOLOGY, INC. |
发明人 |
PARENT, SCOTT R.;THIBAULT, THOMAS M.;PARENT, DONALD G. |
分类号 |
B29C35/08;B29C65/48;B29C65/78;B32B7/12;G11B7/24038;G11B7/26 |
主分类号 |
B29C35/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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