Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module component

摘要

The present invention relates to a module component for which degradation of electrical properties caused by absorption of moisture in the air can be prevented. An intermediate layer (70) comprises a first layer (20), a second layer (30) and a core layer (10). The core layer (10) comprises a material having a higher strength than the first layer (20) and the second layer (30), has a network structure that extends out in planar fashion, has an outer periphery (11) thereof positioned further to the inside than the outer peripheries of the first layer (20) and the second layer (30), and is sealed between the first layer (20) and the second layer (30). An upper layer (71) is laminated on the upper surface of the intermediate layer (70). A lower layer (72) is laminated on the lower surface of the intermediate layer (70). Mounted components (74) are mounted on any one of the upper layer (71) and the lower layer (72).