| 摘要 |
1,262,858. Microcircuits. NATIONAL RESEARCH DEVELOPMENT CORP. 12 May, 1969 [5 March, 1968], No. 10758/68. Heading H1R. In the manufacture of a microcircuit, a microelectronic component 2, e.g. a silicon semiconductor integrated circuit chip, and an electrically insulative substrate 4 are mounted on a thermally conductive substrate 1, an electrically insulative material 7 is cast between the substrate 4 and the component 2 so as to extend over surfaces of the substrate and component, the protruding portions of preformed pillars 8, extending from the component contact area, are removed, e.g. by grinding, and interconnections 9 are formed on the resultant flat surface to make connection between the pillar surfaces and contact areas on an interconnection pattern 5 formed on substrate 4. As shown, the pattern 5 is preformed on the substrate 4, e.g. by metal deposition, screen printing or an etchant resist process, the pattern 5 also having pillars 6, the tops of which are removed, to which the interconnections 9 are made. In alternatives the material 7 covers the whole of the substrate 4 and the pattern 5, Figs. 3 and 4 (not shown), or the pattern 5 is deposited on the covering layer 7, so that the interconnections 9 are continuous with the pattern 5, Figs. 5 and 6 (not shown). The substrate 1 may be ceramic, e.g. alumina or beryllia, or metallic coated with electrically insulative material. It may be formed with flat-topped raised portions for mounting the components, Figs 2, 4, 6 (not shown). The substrate 4, e.g. of alumina, may be a preformed sheet or may be formed from one or more layers of a glaze composition fused in situ. The material 7 may be a glaze or an epoxy resin composition. |
